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MCP2551-I/SN by Microchip Technology
DATA SHEET

MCP2551-I/SN

Microchip Technology

CANBus Transceiver - 1Mbps - Sleep/Standby - 5V - 8-Pin. .. see full description

  • RoHS Compliant
  • TUBE Packaging
  • Accessories
  • Set Notification
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Supplier:
Microchip Technology
Part No:
MCP2551-I/SN
RoHS:
Yes
HTS:
8542390001
COO:
TH
ECCN:
EAR99
Supplier Standard Pack:
61123
Package Type:
TUBE
Category:
Transceiver
Dimension:
4.9 x 3.9 x 1.25(Min) mm
The MCP2551 is a high-speed CAN transceiver, fault-tolerant device that serves as the interface between a CAN protocol controller and the physical bus. The MCP2551 provides differential transmit and receive capability for the CAN protocol controller and is fully compatible with the ISO-11898 standard, including 24V requirements. It will operate at speeds of up to 1 Mb/s.
Search Keywords:
MCP2551ISN
  Different packaging options available.  See Alternatives
IN STOCK: 3,125
Can Ship immediately
Minimum Order:
100
Multiple:
100
Factory Lead-Time
4 Weeks
Enter Quantity
Price (CAD)
Quantity
Unit Price
Ext. Price
100
$1.648
$164.800
300
$1.631
$489.300
500
$1.622
$811.000
1,000
$1.613
$1,613.000
2,500
$1.605
$4,012.500
5,000
$1.597
$7,985.000
7,500
$1.590
$11,925.000
10,000 +
$1.581
$15,810.000
Click for Quote
DOWNLOADS
PDF Datasheet
PDF PCN - 01-Jun-2005 - QUALIFICATION OF 8L SOIC PACKAGE IN STRIP MAGAZINE FORM AT HANA
PDF PCN - 02-May-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 19-Feb-2021 - QUALIFICATION OF A NEW LEAD FRAME DESIGN FOR SELECTED PRODUCTS AVAILABLE IN 8L SOIC PACKAGE
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 01-Nov-2005 - QUALIFICATION OF 8L SOIC AT NEW ASSEMBLY SITE VIGILANT,THAILAND
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol
PDF PCN - 22-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT
PDF PCN - 26-Jun-2015 - QUALIFICATION OF GTK ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE
PDF PCN - 30-Nov-2015 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE FOR SELECTED PRODUCTS
PDF PCN - 08-Feb-2016 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE FOR SELECTED PRODUCTS AT X-FAB
PDF PCN - 03-Jun-2004 - QUALIFY AMKOR SHANGHAI, CHINA (ATC) FOR 8L SOIC PACKAGE
PDF PCN - 15-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i
PDF PCN - 22-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 22-Feb-2018 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 01-Nov-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 19-Nov-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol
PDF PCN - 30-Mar-2022 - MANUFACTURING CHANGE
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 26-May-2005 -
PDF PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 08-Sep-2017 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE FOR PRODUCTS
PDF PCN - 01-Sep-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 22-Jan-2004 -
PDF PCN - 11-Nov-2004 -
PDF PCN - 30-Jun-2016 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE FOR PRODUCTS
PDF PCN - 31-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 03-Jun-2004 - Microchip is qualifying Amkor Shanghai, China (ATC) as an additional assembly capacity for 8L SOIC p
PDF PCN - 28-Jun-2005 -
PDF PCN - 15-May-2015 - QUALIFICATION OF GTK ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS
PDF PCN - 01-Nov-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 19-Nov-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 30-Jun-2016 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE FOR PRODUCTS
PDF PCN - 19-Feb-2021 - QUALIFICATION OF A NEW LEAD FRAME DESIGN FOR SELECTED PRODUCTS AVAILABLE IN 8L SOIC PACKAGE
PDF PCN - 09-Sep-2009 - QUALIFICATION OF NEW WAFER FAB FOUNDRY
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 02-May-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 26-Jun-2015 - QUALIFICATION OF GTK ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE
PDF PCN - 01-Nov-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 22-Feb-2018 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP
PDF PCN - 10-Jul-2010 - Microchip has released a new DeviceDoc for the MCP2551 Datasheet of devices.
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 09-May-2021 - QUALIFICATION OF A NEW LEAD FRAME DESIGN FOR SELECTED PRODUCTS
PDF PCN - 28-Feb-2022 - MANUFACTURING CHANGE
PDF PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 08-Sep-2017 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE FOR PRODUCTS
PDF PCN - 15-May-2015 - QUALIFICATION OF GTK ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE
PDF PCN - 22-Jan-2009 - Microchip is qualifying the new wafer fab foundry for MCP1790,MCP200x and MCP2551 products in order
PDF PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb
PDF PCN - 11-Oct-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 01-Feb-2022 - CANCEL QUALIFICATION OF A NEW LEAD FRAME DESIGN FOR SELECTED PRODUCTS
PDF PCN - 13-Jun-2005 - NEW LEADFRAME SUPPLIER FOR 8L SOIC .150
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 15-May-2015 - QUALIFICATION OF LPI ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE
PDF PCN - 04-Sep-2015 - QUALIFICATION OF LPI ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE
PDF PCN - 08-Feb-2016 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE FOR SELECTED PRODUCTS AT X-FAB
PDF PCN - 01-Sep-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 17-Nov-2009 - Microchip is qualifying a new wafer fab foundry for listed products in order to improve production c
PDF PCN - 04-Sep-2015 - QUALIFICATION OF LPI ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE
PDF PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE
PDF PCN - 15-May-2015 - QUALIFICATION OF LPI ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE
PDF PCN - 01-Nov-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
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