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MCP23S17-E/SS by Microchip Technology
DATA SHEET

MCP23S17-E/SS

Microchip Technology

16-Bit I/O Expander - 10MHz - SPI - 5.5 V - SSOP 28-Pin. .. see full description

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  • TUBE Packaging
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Supplier:
Microchip Technology
Part No:
MCP23S17-E/SS
RoHS:
Yes
HTS:
8542390001
COO:
TH
ECCN:
EAR99
Supplier Standard Pack:
3425
Package Type:
TUBE
Interrupt Output:
Yes
I2C Bus Interface Mode:
Standard Mode
Dimension:
10.2 x 5.3 x 1.75 mm
Maximum Operating Supply Voltage:
5.5 V
Interface Type:
SPI
Manual Reset:
Yes
Interface Speed:
10000 kHz
Family:
MCP23S17
The MCP23S17-E/SS is a 16-bit I/O Expander, provides general purpose parallel I/O expansion for I²C bus or SPI applications. The two devices differ only in the serial interface. It consists of multiple 8-bit configuration registers for input, output and polarity selection. The system master can enable the I/Os as either inputs or outputs by writing the I/O configuration bits (IODIRA/B). The data for each input or output is kept in the corresponding input or output register. The polarity of the Input port register can be inverted with the polarity inversion register. All registers can be read by the system master. The 16-bit I/O port functionally consists of two 8-bit ports (PORTA and PORTB). It can be configured to operate in the 8-bit or 16-bit modes via IOCON.BANK.
Search Keywords:
MCP23S17ESS
  Different packaging options available.  See Alternatives
IN STOCK: 11,515
Can Ship immediately
Minimum Order:
47
Multiple:
47
Factory Lead-Time
4 Weeks
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Price (CAD)
Quantity
Unit Price
Ext. Price
47
$2.111
$99.217
141
$1.999
$281.859
282
$1.979
$558.078
517
$1.969
$1,017.973
1,034
$1.957
$2,023.538
2,538
$1.948
$4,944.024
5,029
$1.938
$9,746.202
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$1.930
$14,513.600
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DOWNLOADS
PDF Datasheet
PDF PCN - 30-Jun-2011 - QUALIFICATION OF 20 & 28L SSOP PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 23-Jan-2015 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE AND 3280 DIE ATTACH EPOXY
PDF PCN - 31-Mar-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND
PDF PCN - 30-Jul-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 22-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT
PDF PCN - 19-Nov-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 01-Sep-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 19-Nov-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 01-Nov-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE
PDF PCN - 15-Nov-2015 - QUALIFICATION OF CUPDAU BOND WIRE AND G700LS MOLDING COMPOUND IN SELECTED PRODUCTS OF THE 150K
PDF PCN - 07-Jun-2016 - CANCELLATION - QUALIFICATION OF CUPDAU BOND WIRE AND G700LS MOLDING COMPOUND IN SELECTED PRODUCTS
PDF PCN - 04-Jan-2011 - QUALIFICATION OF 20 & 28L SSOP PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i
PDF PCN - 10-Jun-2016 - CANCELLATION - QUALIFICATION OF CUPDAU BOND WIRE AND G700LS MOLDING COMPOUND IN SELECTED PRODUCTS
PDF PCN - 06-Oct-2017 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE USING CUPDAU BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 01-Nov-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 14-Oct-2017 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE USING GOLD (AU) BOND WIRE FOR SELECTED PRODUCTS
PDF PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP
PDF PCN - 08-Mar-2007 -
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 28L SSOP package products with SG-8300GM mold co
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 22-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 01-Jul-2022 - DOCUMENT CHANGE
PDF PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M
PDF PCN - 23-Jan-2015 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE AND 3280 DIE ATTACH EPOXY
PDF PCN - 23-Jan-2015 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE AND 3280 DIE ATTACH EPOXY
PDF PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb
PDF PCN - 23-Jan-2015 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE AND 3280 DIE ATTACH EPOXY
PDF PCN - 01-Nov-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 14-Oct-2017 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE USING GOLD (AU) BOND WIRE FOR SELECTED PRODUCTS
PDF PCN - 01-Sep-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 12-Dec-2018 - QUALIFICATION OF 8390A DIE ATTACH MATERIAL FOR SELECTED PRODUCTS OF THE 120K, 150K, 160K AND 200K
PDF PCN - 14-Feb-2019 - QUALIFICATION OF 8390A DIE ATTACH MATERIAL FOR SELECTED PRODUCTS OF THE 120K, 150K, 160K AND 200K
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 11-Oct-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 07-Apr-2011 - Microchip is announcing the qualification of the listed 20 & 28L SSOP packages products with SG-8300
PDF PCN - 01-Nov-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 17-Dec-2017 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE USING GOLD (AU) BOND WIRE FOR SELECTED PRODUCTS
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 11-Nov-2004 -
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 07-Jul-2016 - MCP23017/MCP23S17 DATA SHEET DOCUMENT REVISION
PDF PCN - 28-Feb-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE USING CUPDAU BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 08-Jun-2018 - QUALIFICATION OF PALLADIUMCOATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 14-Jul-2018 - QUALIFICATION OF PALLADIUMCOATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 02-May-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 02-May-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 06-Oct-2017 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE USING CUPDAU BOND WIRE IN SELECTED PRODUCTS
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