help desk software
MCP23S17-E/SP by Microchip Technology
DATA SHEET

MCP23S17-E/SP

Microchip Technology

16-Bit I/O Expander - 10MHz - SPI - 5.5 V - 28-Pin SPDIP - Tube

  • RoHS Compliant
  • TUBE Packaging
  • Accessories
  • Set Notification
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Products found: 0
Supplier:
Microchip Technology
Part No:
MCP23S17-E/SP
RoHS:
Yes
HTS:
8542390001
COO:
TH
ECCN:
EAR99
Package Type:
TUBE
Interface Speed:
10000 kHz
Interface Type:
SPI
Manual Reset:
Yes
Interrupt Output:
Yes
Family:
MCP23S17
I2C Bus Interface Mode:
N/R
Maximum Operating Supply Voltage:
5.5 V
Dimension:
34.67 x 7.24 x 3.43 mm
16-Bit I/O Expander - 10MHz - SPI - 5.5 V - 28-Pin SPDIP - Tube
Search Keywords:
MCP23S17ESP
IN STOCK: 4,695
Can Ship immediately
Minimum Order:
15
Multiple:
15
Factory Lead-Time
4 Weeks
Enter Quantity
Price (CAD)
Quantity
Unit Price
Ext. Price
15
$2.626
$39.390
105
$1.991
$209.055
255
$1.971
$502.605
510
$1.961
$1,000.110
1,005
$1.949
$1,958.745
2,505
$1.941
$4,862.205
5,010
$1.931
$9,674.310
7,500 +
$1.922
$14,415.000
Click for Quote
DOWNLOADS
PDF Datasheet
PDF PCN - 25-Nov-2011 - QUALIFICATION OF 8L,14L,16L,20L PDIP & 28L SPDIP WITH CRM-1064L DIE ATTACH AT ALPH ASSEMBLY SITE
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of the listed 28L SPDIP (.300) packages products at GTK as
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES
PDF PCN - 26-Dec-2013 - Microchip is announcing the qualification of palladium coated copper (PdCu) bond wire at MMT (ALPH)
PDF PCN - 06-Feb-2014 - Microchip is announcing the qualification of selected products available in the 28L SPDIP, 8L PDIP,
PDF PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS WITH PALLADIUM COATED COPPER (PDCU) BOND WIRE AT MTAI
PDF PCN - 01-Sep-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 25-Nov-2011 - QUALIFICATION OF 8L, 14L, 16L, 20L PDIP & 28L SPDIP WITH CRM-1064L DIE ATTACH AT ALPH ASSEMBLY SITE
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of the CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PD
PDF PCN - 30-Mar-2014 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 01-Jul-2022 - DOCUMENT CHANGE
PDF PCN - 18-Dec-2013 - Microchip is announcing the qualification of the listed products in the 28L SPDIP, 8L PDIP, and 18L
PDF PCN - 01-Nov-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 01-Nov-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 08-Oct-2007 - Qualification of GE800 mold compound in assorted PDIP/SPDIP packages at ALPH.
PDF PCN - 02-Nov-2007 - Microchip is qualifying G600 mold compound in PDIP packages at CEI and NSEB.
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES
PDF PCN - 30-Apr-2020 - QUALIFICATION OF G600V AS AN ADDITIONAL/ALTERNATIVE MOLD COMPOUND MATERIAL
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 26-Jan-2011 - Microchip is announcing qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (.300
PDF PCN - 11-Oct-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 02-May-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 01-Nov-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 26-Jan-2011 - Microchip is announcing the qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (
PDF PCN - 31-Mar-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND
PDF PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb
PDF PCN - 30-Jul-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).
PDF PCN - 12-Nov-2010 - QUALIFICATION OF 28L SPDIP (.300) PACKAGES AT GTK ASSEMBLY SITE.
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i
PDF PCN - 07-Jul-2016 - MCP23017/MCP23S17 DATA SHEET DOCUMENT REVISION
PDF PCN - 01-Sep-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 19-Nov-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 02-May-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP
PDF PCN - 18-Sep-2013 - Microchip is announcing the qualification of the listed products available in the 28L SPDIP, 18L PDI
PDF PCN - 10-Apr-2014 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 08-Mar-2007 -
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES
PDF PCN - 01-Nov-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 30-Jan-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES
PDF PCN - 28-Feb-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES
PDF PCN - 11-Nov-2004 -
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS WITH PALLADIUM COATED COPPER (PDCU) BOND WIRE AT MTAI
PDF PCN - 30-Mar-2014 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 01-Jun-2016 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 01-Jun-2016 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 23-Aug-2013 - Microchip is announcing the qualification of the listed products available in the 28L SPDIP, 8L PDIP
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 28L SPDIP (.300) packages products at GTK assemb
PDF PCN - 19-Nov-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
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