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MCP23S08-E/ML by Microchip Technology
DATA SHEET

MCP23S08-E/ML

Microchip Technology

I/O Expander - 8bit - 10 MHz - SPI - 1.8 to 5.5 V - 20-Pin QFN - Tube .. see full description

  • RoHS Compliant
  • TUBE Packaging
  • Accessories
  • Set Notification
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Supplier:
Microchip Technology
Part No:
MCP23S08-E/ML
RoHS:
Yes
HTS:
8542390001
COO:
TH
ECCN:
EAR99
Supplier Standard Pack:
6600
Package Type:
TUBE
Maximum Operating Supply Voltage:
5.5 V
I2C Bus Interface Mode:
N/R
Family:
MCP23S08
Interface Speed:
10000 kHz
Interrupt Output:
Yes
Interface Type:
SPI
Dimension:
4 x 4 x 0.88 mm
Manual Reset:
Yes
The MCP23S08-E/ML is an 8-bit I/O expander ideally suited for applications requiring additional I/O pins in a compact package. With a 10 MHz SPI interface, this device can seamlessly extend the number of input/output pins in a wide range of embedded systems.Operating at a voltage range of 1.8 to 5.5 V, the MCP23S08-E/ML provides flexibility for use in various applications. Its 20-pin QFN packaging offers a compact form factor, making it suitable for space-constrained designs.This I/O expander from Microchip Technology offers a reliable and efficient solution for projects requiring additional I/O pins, enabling easy expansion and integration with existing systems. Packaged in a tube for convenient handling, the MCP23S08-E/ML is a reliable and versatile device that provides enhanced functionality to any platform requiring extra I/O capabilities.
Search Keywords:
MCP23S08EML
  Different packaging options available.  See Alternatives
IN STOCK: 2,548
Can Ship immediately
Minimum Order:
91
Multiple:
91
Factory Lead-Time
7 Weeks
Enter Quantity
Price (CAD)
Quantity
Unit Price
Ext. Price
91
$1.962
$178.542
182
$1.952
$355.264
546
$1.925
$1,051.050
1,001
$1.915
$1,916.915
2,548
$1.905
$4,853.940
5,005
$1.895
$9,484.475
7,553 +
$1.886
$14,244.958
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PDF Datasheet
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PDF PCN - 06-Feb-2008 - Qualification of CRM1706DJ die attach EPOXY and G770HCD mold compound for 20L QFN (4X4), 28L QFN (6X
PDF PCN - 22-Feb-2011 - CCB 1029.02: QUALIFICATION OF 16 & 20L QFN (4X4) PACKAGES WITH EFTEC-64T LEADFRAME AT NSEB (UTL)
PDF PCN - 31-Aug-2017 - FINAL NOTICE QUALIFICATION OF CUPDAU BOND WIRE AND C194 LEAD FRAME MATERIAL
PDF PCN - 28-Jan-2014 - Microchip is announcing the qualification of 28L QFN (6x6x0.9mm and 5x5x0.9mm), 20L QFN (5x5x0.9mm a
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 21-Oct-2016 - QUALIFICATION OF CUPDAU BOND WIRE AND C194 LEAD FRAME MATERIAL
PDF PCN - 28-Jan-2014 - QUALIFICATION OF 28L QFN, 20L QFN AND 16L QFN PACKAGES AT MTAI ASSEMBLY SITE
PDF PCN - 25-Jun-2015 - CANCELLATION NOTICE: QUALIFICATION OF SELECTED PRODUCTS WITH PDCU BOND WIRE AT MTAI SITE
PDF PCN - 26-Dec-2013 - Microchip is announcing the qualification of the listed 28L QFN (6x6x0.9mm and 5x5x0.9mm), 20L QFN (
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PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 01-Apr-2014 - QUALIFICATION OF SELECTED PRODUCTS IN 28L QFN, 20L QFN & 16L QFN WITH PDCU BOND WIRE AT MTAI SITE
PDF PCN - 10-Jun-2011 - QUALIFICATION OF 16 & 20L QFN (4X4) PACKAGES WITH EFTEC-64T LEADFRAME AT NSEB (UTL)
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PDF PCN - 10-Jun-2011 - Microchip is announcing the qualification of 16 & 20L QFN (4x4) packages with EFTEC-64T leadframe at
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 31-Aug-2017 - FINAL NOTICE QUALIFICATION OF CUPDAU BOND WIRE AND C194 LEAD FRAME MATERIAL
PDF PCN - 06-Feb-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 20-Jul-2015 - QUALIFICATION OF G700LTD MOLD COMPOUND AND 8600 DIE ATTACH IN VARIOUS QFN PACKAGES
PDF PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M
PDF PCN - 20-Jul-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 22-Feb-2011 - Microchip is announcing the qualification of 16 & 20L QFN (4x4) packages with EFTEC-64T leadframe at
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) assembly site for the listed pro
PDF PCN - 26-Dec-2013 - QUALIFICATION OF 28L QFN, 20L QFN AND 16L QFN PACKAGES AT MTAI ASSEMBLY SITE
PDF PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 05-Feb-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 01-Apr-2014 - QUALIFICATION OF SELECTED PRODUCTS IN 28L QFN, 20L QFN & 16L QFN WITH PDCU BOND WIRE AT MTAI SITE
PDF PCN - 08-Mar-2007 -
PDF PCN - 16-Feb-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE
PDF PCN - 20-Jul-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 20-Jan-2012 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) for the listed products in order
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
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